Applications in the electronics and semiconductor market often require unique tape solutions with parts becoming smaller and more complex. Cactus offers a variety of products that are developed to meet the requirements of these innovative market sectors. Our solutions enable reliable performance and consistent quality for various applications.
Chemical Mechanical Planarization (CMP) Pads
Chemical Mechanical Planarization (CMP) Pads
Cactus® offers a wide range of differential tapes and permanent bonding tapes that are designed for various CMP application needs.
Features
High shear adhesive to ensure secure bonding
LSE adhesive ideal for laminating hard-to-bond foam pads
Removable options available with various adhesion levels.
Display Bonding
Display Bonding
Cactus® tape offers both thin bonding and foam tapes for display bonding applications.
Features
Repulsion-resistant adhesive to prevent lifting on both flat and curved surfaces
Thin tapes and transfer tapes to minimize thickness profile
